FLIP CHIP LIGHT-EMITTING DEVICE HAVING ARRAYED CELLS AND METHOD OF MANUFACTURING THE SAME

摘要

A flip chip light emitting device having arrayed cells and a method for manufacturing the same are provided to obtain high brightness and high luminous intensity by forming a concavo-concave portion on a semiconductor layer. A light emitting device includes a substrate(20) and a sub-mount substrate(100). The substrate further includes a plurality of light emitting cells. The light emitting cells are provided with an N-type semiconductor layer(40) and a P-type semiconductor layer(60) located on the N-type semiconductor layer. The substrate is bonded on the sub-mount substrate by flip-chip bonding. At the time, a concavo-concave portion(22) is formed at least one surface of the substrate.