SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

摘要

Disclosed is a semiconductor device wherein a semiconductor chip (501) is mounted on the surface of an electrically insulating substrate (504) having a plurality of metal wires (505) and at least a part of the metal wires (505) are covered with a resin (509). Among the metal wires (505) formed in the electrically insulating substrate (504), at least the surfaces of the metal wires electrically connected with the semiconductor chip (501) are provided with a gold layer (508), and the surfaces of the metal wires in contact with the resin (509) are provided with a roughened portion (507) without being provided with a gold layer. Consequently, the semiconductor device mounted with a semiconductor chip is improved in reliability of electrical connection. Also disclosed is a method for manufacturing such a semiconductor device.