UNDERLAYER FILM FORMING MATERIAL FOR HEAT LITHOGRAPHY, RESIST LAMINATE AND RESIST PATTERN FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an underlayer film forming material for heat lithography usable as a heat conversion object in heat lithography and consisting of organic materials, and a resist laminate and a resist pattern forming method using the underlayer film forming material for heat lithography.

SOLUTION: The underlayer film forming material for heat lithography for forming an underlayer film for heat lithography between a support and a resist film contains an organic compound (A1) having film forming ability and a dye (B) which absorbs light of a wavelength of an exposure light source used in heat lithography. An underlayer film for heat lithography formed using the underlayer film forming material for heat lithography is an organic film having an absorbance of ≥0.26 per 100 nm film thickness at the wavelength of the exposure light source.

COPYRIGHT: (C)2008,JPO&INPIT