| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power module having an insulating circuit board mounted thereon, with good usability, low thermal resistance, and high reliability. SOLUTION: There is provided a semiconductor power module having an insulating circuit board 500 mounted thereon, on which one layer or more of a thermal diffusion plates 3 provided with a ceramic plate 2 are disposed between a circuit plate 1 and a heat dissipation plate 5, and the heat dissipation plate is set as an electric conducting path of a semiconductor power element. COPYRIGHT: (C)2008,JPO&INPIT
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