INTEGRATED CIRCUIT DEVICE COMPRISING ENVIRONMENT-HARDENED DIE AND LESS-ENVIRONMENT-HARDENED DIE

摘要

An integrated circuit device has at least one environment-hardened die and at least one less-environment-hardened die. Environment-hardened circuitry on the environment-hardened die is more resistant to the degradation when exposed to a predetermined environmental condition than the less-environment-hardened circuitry on the environment-hardened die. The dice are combined using a 3D or 2.5D integrated circuit technology. This is very useful for testing circuits at adverse environmental conditions (e.g. high temperature), or for providing circuits to operate at such conditions.

主权项

1. An integrated circuit device comprising:
at least one environment-hardened die comprising environment-hardened circuitry; and at least one less-environment-hardened die comprising less-environment-hardened circuitry, wherein the environment-hardened circuitry is more resistant to degradation when exposed to at least one predetermined environmental condition than the less-environment-hardened circuitry; wherein:(i) the integrated circuit device comprises a plurality of vertically stacked dice including the at least one environment-hardened die and the at least one less-environment-hardened die; or(ii) the at least one environment-hardened die and the at least one less-environment-hardened die are mounted on an interposer to provide communication between the at least one environment-hardened die and the at least one less-environment-hardened die.