| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, from which a semiconductor device, that has excellent continuous moldability and exhibits excellent reliability characteristics under a high-temperature high-humidity condition to a copper wire, can be obtained.SOLUTION: The epoxy resin composition for sealing semiconductors contains an epoxy resin (A), a phenolic resin (B), a curing promotor (C) and an inorganic filler (D). The epoxy resin composition is cured under the following condition (x) and the cured epoxy resin composition is made to absorb moisture under the following condition (y) to obtain a cured product (a disk having the diameter equal to or larger than that of an electrode of an apparatus for measuring dielectric relaxation). When the dielectric relaxation of the obtained cured product is measured, the frequency at the point of time that the dielectric loss becomes 0.81±0.05 is ≤25 Hz on the peak of the dielectric loss resulting from ionic polarization and the shear modulus at the point of time that the epoxy resin composition is heated/cured at 175°C for 90 seconds is ≥120 MPa. Wherein, the condition (x) is the after-cure at 175±10°C for 3±2 hours after heated and cured at 175±10°C for 120±40 seconds. The condition (y) is the moisture-absorption at 130°C and 85% RH (relative humidity) for 80±30 hours. |
