发明名称 VERTICAL MAGNETIC BARRIER FOR INTEGRATED ELECTRONIC MODULE
摘要 An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
申请公布号 US2016380606(A1) 申请公布日期 2016.12.29
申请号 US201514754241 申请日期 2015.06.29
申请人 Analog Devices Global 发明人 Limjoco Aldrick S.;Cusack Michael;O'Sullivan Donal G.;Meehan Patrick John;Conway Thomas
分类号 H03H7/01;H01L23/31;H01L23/552;H01L25/16;H05K1/11;H05K3/30;H05K3/28;H05K1/18;H05K1/02;H05K7/06;H01L23/495 主分类号 H03H7/01
代理机构 代理人
主权项 1. An integrated electronic component assembly, comprising: an electrically-conductive structure comprising: two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly;a first component attachment region for a first component within the integrated electronic component assembly; anda second component attachment region for a second component within the integrated electronic component assembly; and an electrically-conductive magnetically-permeable shield located within the integrated electronic component assembly, the electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
地址 Hamilton BM