发明名称 Method for Producing an LED Module and LED Module
摘要 Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.
申请公布号 US2016380166(A1) 申请公布日期 2016.12.29
申请号 US201314421153 申请日期 2013.08.07
申请人 OSRAM GmbH 发明人 Reiss Martin;Schwalenberg Simon
分类号 H01L33/58;H01L33/62;H01L25/075;H01L33/48 主分类号 H01L33/58
代理机构 代理人
主权项 1. A method for producing an LED module comprising: providing a housing, which is implemented as a hollow body, which has an opening on a light exit side of the LED module, wherein the housing has a base side, which is arranged opposite to the light exit side; arranging a circuit board having at least one LED on the base side of the housing; pouring in at least one first base layer made of a curable material in a non-cured state through the opening into the housing; and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing;wherein the scattering layer is poured in onto the first base layer, wherein the first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the at least one first base layer and the scattering layer are cured.
地址 Munich DE