发明名称 MULTI-CHIP PACKAGE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a multi-chip package device which includes two or more memory chips and is capable of effectively accessing a bootcode for executing a priority processing instruction, and method of driving the same. SOLUTION: The multi-chip package device includes first and second memory chips configured to share addresses and control signals. The first and second memory chips each include main memory and buffer memory. The main memory stores a bootcode for performing operation according to a predetermined priority processing instruction. The buffer memory includes a boot RAM for temporarily storing said boot code. Each of the first and second memory chips includes an access signal generation block which generates a main access signal for driving access to the main memory and a buffer access signal for driving access to the buffer memory in response to the address and the control signal. The one-way transition of the buffer access signal is executed in response to an address of predetermined boot combination. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006268827(A) 申请公布日期 2006.10.05
申请号 JP20060000815 申请日期 2006.01.05
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM TAE-KYUN;CHO HYUN-DUK
分类号 G06F12/06;G06F12/00 主分类号 G06F12/06
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