| 摘要 |
<p>A device for soldering printed circuit boards (12), with a solder container (22) in a casing (17, 20, 21) through which the boards (12) are passed and brought into contact with a soldering shaft (24), and an inert gas distribution system (19, 31) comprising nozzle unit(s) (41, 43) spanning the container (22) and connected to a gas supply, in which these units (41, 43) are fitted at intervals over at least part of their length with delivery nozzles (44) and means are provided for uniform gas distribution at the nozzles (44).</p> |
