PURPOSE: An injection mold is provided to distribute molten resin uniformly on a first molding surface by adhering film deformed by a suction force of a suction tool over a first mold surface. CONSTITUTION: An injection mold(10) consists of a first and second molds(11,12), and a vacuum pump(13). The first and second molds have a first and second mold faces(11a,12a). The second mold face forms a cavity conforming to an injection molded product with the first mold surface. The vacuum pump creates a suction force. A suction tool(11b) is formed in the first mold face and sucks the first mold face by the suction force from the vacuum pump.
申请公布号
KR20090126415(A)
申请公布日期
2009.12.09
申请号
KR20080052478
申请日期
2008.06.04
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, CHEUL GON;PARK, JUN HO;SONG, JUN GYU;JEON, PHIL JAE