| 摘要 |
This invention provides an adhesive composition for a semiconductor, comprising filler particles (A), a heat curing resin (B), and a sulfide bond-containing compound (C) represented by formula (1): -(S)- (1) where n is an integer of 1 or more, wherein the compound (C) is any one of a compound (C1-1), which is a compound (C1) containing the sulfide bond and an alkoxysilyl group and wherein the content of a compound containing a disulfide bond in the compound (C1) containing the sulfide bond and the alkoxysilyl group is not less than 15% in terms of the proportion of a peak area attributable to the compound containing the disulfide bond to a total peak area of the compound (C1) containing the sulfide bond and the alkoxysilyl group, a compound (C2) containing the sulfide bond and a hydroxyl group as measured by high performance liquid chromatography, and the compound (C1) containing the sulfide bond and the alkoxysilyl group and the compound (C2) containing the sulfide bond and the hydroxyl group. |
