发明名称 CUTTING DEVICE AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting method by which a plate-like work-piece can be held stably on a chuck table even when performing cutting processing while holding the plate-like work-piece on the chuck table without using an annular frame, spraying cutting liquid through a cutting liquid nozzle and removing cutting chips.SOLUTION: In a cutting method using a cutting device 1, protruding parts Td of a dicing tape T to which is not adhered a plate-like work-piece W are inclined to descend toward an outer periphery of a chuck table 3 from a work-piece suctioning surface 32, and the protruding parts Td are suctioned by tape suctioning surfaces 33 of the chuck table 3a, so that cutting liquid which is sprayed through cutting liquid nozzles 63 and 64 can be prevented from entering a gap between the chuck table 3a and the dicing tape T during cutting processing. This can suppress the dicing tape T from being twisted and maintain suctioning force of a holding surface 30 of the chuck table 3, so that the plate-like work-piece W can be stably suctioned and held.SELECTED DRAWING: Figure 7
申请公布号 JP2016119399(A) 申请公布日期 2016.06.30
申请号 JP20140258539 申请日期 2014.12.22
申请人 DISCO ABRASIVE SYST LTD 发明人 FUKUOKA TAKEOMI
分类号 H01L21/301;B24B27/06 主分类号 H01L21/301
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