| 摘要 |
The invention relates to a housing system (1) for electronic devices, especially for the automobile sector. Said housing system (1) comprises a top part and a bottom part. According to the invention, a pressure compensation film (6) is fixed to the bottom part (2) of the housing as a top part of the housing. Advantageously, the inventive housing system is flexible, can be individually and thus variably adjusted to the space required, and encompasses a sealing system that is integrated in a pressure compensation element. The invention is suitable particularly for applications in the automobile sector. |
