MANUFACTURING METHOD FOR A SOLID-STATE IMAGING APPARATUS, AND THE SOLID-STATE IMAGING APPARATUS

摘要

A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S 11 ), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S 22 ), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S 23 ). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S 18 ).