| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a protection method of a simple wafer circuit side which makes it possible to suppress a degradation in quality of a wafer to which a backside grinding is carried out. <P>SOLUTION: One of practical embodiments of the protection method of the wafer circuit side includes steps of: providing a resin layer 2 thicker than a height of a high bump 100, while filling skirts 100A of the high bump 100 by making a circuit side 10 of a wafer 1 providing the high bump 100 an object; and laminating a tape base material 3 on this resin layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
