发明名称 AUTOMATIC MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the following problems: when in an automatic molding apparatus, by continuous operation, a component to be molded is molded, resin chips produced on the periphery of a plunger are packed and caught in the operation part of the apparatus to make a failure occur in the movement of the operation part to damage the apparatus or to produce a defective in a molded product. SOLUTION: In the automatic molding apparatus, in a part approaching the upper surface side of a lower die set of a stitch formed to lift the plunger to the lower die set suitably for a framework, a sealant which stops the passage of the falling resin chips and seals it is installed, while on the upper surface side of the lower die set, a tabular or a discoid tabular member is installed at a small interval between its lower surface side and the upper surface side of the lower die set, an air passage is formed in the lower die set by a space of its distance, and the air passage is made to communicate with the upper surface side of the sealant and a duct connected to a suction opening. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010017861(A) 申请公布日期 2010.01.28
申请号 JP20080177755 申请日期 2008.07.08
申请人 MTEX MATSUMURA CO 发明人 OTAKI AKIHIRO
分类号 B29C45/17;B29C45/02;B29C45/14 主分类号 B29C45/17
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