SPUTTERING DEVICE AND METHOD OF FORMING LAYER USING THE SAME

摘要

The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

主权项

1. A method for forming a thin layer, comprising:
placing a substrate within a chamber; placing a target facing the substrate; depositing target particles emitting from the target on the substrate using a sputtering process; and moving a plurality of shield rods in a first direction, wherein the plurality of shield rods are installed in a shield mask and separated from each other along the first direction, and the shield mask is disposed between the substrate and the target, the shield mask comprising a plurality of sidewalls that define an opening and a plurality of grooves that are formed in two facing ones of the sidewalls.