| 摘要 |
PROBLEM TO BE SOLVED: To remove sulfuric acid remaining on a substrate without damaging the substrate.SOLUTION: A substrate processing method according to one embodiment includes: a mixed liquid supply step; a cooling step; and a hydrogen peroxide solution supply step. In the mixed liquid supply step, a mixed liquid of sulfuric acid and hydrogen peroxide solution is supplied to a substrate. In the cooling step, a substrate which has done the mixed liquid supply step is cooled. In the hydrogen peroxide solution supply step, the hydrogen peroxide solution is supplied to the substrate which has done the cooling step. |
