| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor product in which a connection pad on a semiconductor chip can be connected selectively to an electrode on a substrate, a design change can be added to the product specification without performing the design change of a semiconductor chip and a compact laminated substrate. <P>SOLUTION: The semiconductor product is formed by flip chip bonding the semiconductor chip and the compact laminated substrate, wherein the semiconductor chip is equipped with a connection pad connected to the electrode on the compact laminated substrate, and wherein the connection pad has two or more internal pad portions physically independent within the same electrode. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
