发明名称 Mounting an electrical component within a substrate
摘要 An electrical component 3, such as an integrated circuit of a radio frequency identification device (RFID) or RF tag, is located in a channel 2 formed in a substrate 1. The channel 2 is filled with conductive material such as a conductive ink to connect to electrodes 4 of component 3. The conductive track formed by the conductive material in the channel 2 may act as the antenna of the RFID. The integrated circuit 3 is embedded and fixed within the channel 2 by the conductive ink, making the connections between the integrated circuit 3 and the antenna less liable to damage from e.g. flexing of the substrate. In another embodiment, the RF tag may include an organic semiconductor device formed within the channel and the antenna may also be used for inductively powering the tag (figure 3).
申请公布号 GB2436221(A) 申请公布日期 2007.09.19
申请号 GB20070005101 申请日期 2007.03.16
申请人 UVASOL LIMITED 发明人 KEITH FAWDINGTON
分类号 G06K19/077;H01L23/14;H05K1/18;H05K3/10 主分类号 G06K19/077
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