| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor that measures pressure of an object to be measured suitably and has improved electrical reliability.SOLUTION: A semiconductor pressure sensor 1 comprises: a substrate 2 that has a housing recess 11 that is open upward and a connection terminal 12 that is exposed to the bottom of the housing recess; a pressure sensor element 3 that is provided at the bottom of the housing recess; a bonding wire 4 that electrically connects the pressure sensor element and the connection terminal mutually; and a protective agent 5 that is contained in the housing recess and covers the pressure sensor element, the connection terminal, and the bonding wire. The position at which the bonding wire is bonded to the pressure sensor element is closer to the center C1 of the housing recess than the position at which the bonding wire is bonded to the connection terminal. The bonding wire is bonded to the connection terminal using first bonding. The bonding wire is bonded to the pressure sensor element using second bonding.SELECTED DRAWING: Figure 2 |
