摘要 |
Systems and methods to suppress the formation of parasitic particles during the deposition of a III- V nitride film with, e.g., metal-organic chemical vapor deposition (MOCVD) are described. In accordance with certain aspects of the invention, a hotwall reactor design and methods associated therewith, with wall temperatures similar to process temperatures, so as to create a substantially isothermal reaction chamber, may generally suppress parasitic particle formation and improve deposition performance.
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申请人 |
APPLIED MATERIALS, INC.;BOUR, DAVID;SMITH, JACOB;NIJHAWAN, SANDEEP;WASHINGTON, LORI |
发明人 |
BOUR, DAVID;SMITH, JACOB;NIJHAWAN, SANDEEP;WASHINGTON, LORI |