| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing an electronic part suppressing generation of void and being excellent in continuous molding property. SOLUTION: The resin composition for sealing the electronic part contains the following (A)-(C) and further contains the following (D)-(F). (A) epoxy resin, (B) curing agent, (C) non-spherical inorganic filler, (D) polydiorganosiloxane having a reactive group not having a polyalkyl ether bond and having reactivity with at least one of the (A) epoxy resin and (B) curing agent and having an equivalent of the reactive group of 400-1,000, (E) amide based wax, and (F) ester based wax. COPYRIGHT: (C)2010,JPO&INPIT
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