发明名称 SEGMENTATION METHOD OF FRAGILE MATERIAL SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To surely form and segment a crack line along a segmentation-scheduled line, in the segmentation of a fragile material substrate.SOLUTION: Groove-shaped trench lines TL1 to TL6 are formed which are not accompanied by cracks with respect to a segmentation-scheduled line of a fragile material substrate. A glass substrate 20 on which the trench lines TL1 to TL6 are formed is inverted, and an assist line AL1 is formed so as to intersect with the trench lines from an opposite face at 70° or smaller and 110° or larger with respect to the trench lines. By segmenting the glass substrate 20 along the assist line AL1, a crack is made to progress along the trench lines, a crack line is formed, and the substrate is segmented along the crack line.SELECTED DRAWING: Figure 2
申请公布号 JP2016210026(A) 申请公布日期 2016.12.15
申请号 JP20150093254 申请日期 2015.04.30
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SOYAMA HIROSHI
分类号 B28D5/00;C03B33/023 主分类号 B28D5/00
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