发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve the laminating accuracy of a die and a substrate even while reducing costs. Ž<P>SOLUTION: A recessed part 16 is formed on the substrate 11 so as to form a level difference at the outer edge part of a sticking region 15 where the die 13 is to be stuck on the substrate 11 simultaneously with the formation of an alignment mark 17. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010021258(A) 申请公布日期 2010.01.28
申请号 JP20080179025 申请日期 2008.07.09
申请人 SHARP CORP 发明人 MATSUMOTO SUSUMU;TAKEI MICHIKO;TADA NORIFUMI;TAKATO YUTAKA
分类号 H01L21/02;H01L27/12 主分类号 H01L21/02
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