| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching method of improving wetness between a substrate and an etching liquid without irregularity and carrying out an etching treatment to suppress the irregularity of an extent of etching, thus to carry out a precise etching treatment. Ž<P>SOLUTION: A mist of particles of liquid L kept in a state of globular shapes with smaller surface areas because of their surface tension is caused to stick to a substrate 10 without dots. This suppresses the formation of a portion where wetness is not improved, which secures uniform wetness between the substrate 10 and the etching liquid L, thus enables carrying out a precise etching treatment on the substrate 10. As a result, the thickness ta of the substrate 10 is reduced precisely. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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