| 发明名称 |
PIPING STRUCTURE, COOLING DEVICE INCLUDING THE SAME, AND METHOD FOR TRANSPORTING REFRIGERANT VAPOR |
| 摘要 |
It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage. |
| 申请公布号 |
US2016290691(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201415036688 |
申请日期 |
2014.11.10 |
| 申请人 |
NEC CORPORATION ;NEC PLATFORMS , LTD. |
发明人 |
CHIBA Masaki;YOSHIKAWA Minoru;SHOUJIGUCHI Akira;INABA Kenichi;MATSUNAGA Arihiro;SATO Masanori;HOSAKA Tadao;NAKAMURA Yasuhito |
| 分类号 |
F25B41/00 |
主分类号 |
F25B41/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A piping structure, comprising:
a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage. |
| 地址 |
Tokyo JP |
