| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for an electrical component that can be manufactured in a simple process and at low cost.SOLUTION: In an IC socket 12, an IC package 11 is accommodated in an upper plate 14, a lower plate 16 is disposed oppositely on a wiring board 10, an intermediate plate 15 is disposed in the middle between the upper plate 14 and the lower plate 16, and the IC package 11 and the wiring board 10 are electrically connected by a plurality of wire probes 13. In the IC socket, an L-shaped contact part 32 is formed by bending a distal end portion of a second contact part 13c of the wire probe 13 approximately in an L shape, and a bent portion 32a of the L-shaped contact part 32 is pressed in contact with an electrode 10a of the wiring board 10 by a pressing force of the lower plate 16.SELECTED DRAWING: Figure 2 |
