发明名称 PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board including a highly accurate capacitor in its inside and capable of achieving high density wiring, a method for manufacturing the printed wiring board, and an electronic apparatus loaded with the printed wiring board. <P>SOLUTION: The printed wiring board is provided with insulating layers 11, 16; wiring layers 12p, 17p formed so as to be laminated on the insulating layers 11, 16; and a capacitor connected to the wiring layers 12p, 17p. The capacitor is composed of an external electrode 14e formed along the inner peripheral surface of an outside hole 13 formed on the insulating layers 11, 16, a ferroelectric substance 15 charged in the inside of the external electrode 14e, and an inner electrode 19e formed on the center of the ferroelectric substance 15 coaxially with the external electrode 14e. Accordingly, the highly reliable capacitor prevented from the reduction of voltage resistance and short-circuit between the electrodes can be built in the printed wiring board. Further, by forming a packaging land 19b on the inner electrode 19e, an electronic component can be packaged close to the capacitor. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008028188(A) 申请公布日期 2008.02.07
申请号 JP20060199703 申请日期 2006.07.21
申请人 SHARP CORP 发明人 UENO YUKIHIRO
分类号 H05K3/46;H01L23/12;H05K1/16 主分类号 H05K3/46
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