| 摘要 |
Provided is a polyimide composition with which it is possible to achieve a low thermal expansion coefficient and high heat resistance, the polyimide composition having exceptional solubility of polyamide acid varnish. Provided are: a polyamide acid composition comprising a tetracarboxylic acid compound that includes an aromatic tetracarboxylic acid compound having a naphthalene skeleton, and a diamine compound that includes an aromatic diamine compound having a biphenyl skeleton; and a polyimide composition. |
