Electronic device and method of manufacturing the same

摘要

In manufacturing an electronic device in which a semiconductor chip including an element layer formed on a front surface of a substrate and a heat sink to perform heat radiation of the semiconductor chip are connected via a heat spreader, a first heat spreader is formed on a rear surface of the semiconductor chip using a first carbon nanotube, a second heat spreader is formed on the heat sink using a second carbon nanotube, and the first heat spreader and the second heat spreader are caused to adhere to each other. With this configuration, a highly reliable electronic device that has very low heat resistance and achieves efficient heat radiation with a relatively simple configuration is fabricated.

主权项

1. An electronic device, comprising:
an electronic part including an element layer formed on a front surface of a substrate; a heat sink performing heat radiation of the electronic part; and a heat spreader provided between a rear surface of the electronic part and the heat sink, wherein the heat spreader comprises
a first heat spreader formed on the rear surface of the electronic part and comprising a first composite material of a first carbon nanotube and a first metal, anda second heat spreader formed on the heat sink and comprising a second composite material of a second carbon nanotube and a second metal, wherein the first composite material has a first flat surface and the second composite material has a second flat surface, and the first flat surface where a tip of the first carbon nanotube is located and the second flat surface where a tip of the second carbon nanotube is located are caused to adhere to each other with facing and being brought into contact with each other.