Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung

摘要

After a bond (7) between a wire (3) and a substrate (4) or bond-pad has been created by an ultra-sonic device (1) a testing force (5) is applied on the wire (3) using the forces generated by the device (1). The invention also relates to the ultra-sonic device (1) used for the creation of the bond (7) between a wire (3) and a substrate (4). The testing force (5) is applied on the wire (3) or the connection (7) in particular in a right angle to the wire (3) creating a relative motion between the wire (3) and the device (1) comprising a sensor for the detection of the level of forces or the motion.