MULTI-CHIP STRUCTURE AND METHOD FOR FORMING SAME

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip package structure and a method for forming the same.

SOLUTION: A chip 502 is mounted on a substrate 501. A molding substance 503 is formed so as to surround the chip 502. A dielectric layer 505 is formed on the surface of the chip 502 so that a pad 504 of the chip 502 is exposed and a rearranged conductive layer 506 to be connected to the pad 504 is formed. A rearranged conductive layer 509 is formed also on a chip 512 and a solder bump/ball 508 is connected to the rearranged conductive layer 506 and the rearranged conductive layer 509. A molding substance 517 is formed so as to surround the chip 512 and the molding substance 517 includes a via 513 that penetrates through the interior thereof and further the via 513 is connected to the rearranged conductive layer 506.

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