发明名称 PAD MOLDING MOLD AND PAD
摘要 <p>This invention provides a pad molding mold which can ensure a necessary bonding area between a rubber material of a pressing pad (26) and a wire (24) and can prevent the occurrence of waving and bending of a wire (24) after molding. In a two-split mold for molding a pressing pad (26) having a pressing face (22) for pressing the outer peripheral surface of a fixing roller (16), a holding groove (42) for providing a wire (24) attached along one side of the pressing face (22) is provided in one split mold (29a) in the two-split mold. A plurality of protrusions (46) for pressing the outer surface of the wire (24) is intermittently provided in the longitudinal direction in the other split mold (29b), in the two-split mold, at its site opposed to the holding groove (42). The fixing roller (16) includes a pressing roller, and the pressing pad (26) includes a fixing pad.</p>
申请公布号 WO2009013880(A1) 申请公布日期 2009.01.29
申请号 WO2008JP01905 申请日期 2008.07.16
申请人 FUJITA, TAKESHI;SWCC SHOWA DEVICE TECHNOLOGY CO., LTD.;KURATA, HIROSHI;YAMAZAKI, SHINJI 发明人 FUJITA, TAKESHI;KURATA, HIROSHI;YAMAZAKI, SHINJI
分类号 G03G15/20;B29C33/12 主分类号 G03G15/20
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