INDIUM-TIN-SILVER BASED LEAD FREE SOLDER

摘要

Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector (18, 30) to an electrical contact surface (16) on a glass component (10). Methods of forming the alloys are also described herein.