| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers, which enables both of the reduction in surface defect and the achievement of a high polishing speed, and is superior in storage stability.SOLUTION: A polishing liquid composition for silicon wafers comprises: silica particles; a nitrogen-containing basic compound; a first water-soluble polymer compound expressed by the general formula (1); and a second water-soluble polymer compound including an alcoholic hydroxyl group.SELECTED DRAWING: None |
