INTEGRATED PASSIVE DEVICE AND METHOD FOR MANUFACTURING INTEGRATED PASSIVE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a via in an integrated circuit device, and particularly to provide an integrated passive device.SOLUTION: This disclosure provides a system, a method and an apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. The width of the vias is greater than the width of at least one of the conductive traces.SELECTED DRAWING: Figure 4A