| 摘要 |
PROBLEM TO BE SOLVED: To suppress failure of semiconductor substrate due to out gas in a FOUP.SOLUTION: A FOUP 1 has a body 2 including an opening 2d for carrying in and out a semiconductor wafer 4, a lid 3 adhering to the body 2 so as to close the opening 2d, and provided detachably in the body 2, a suction hole 2f and an exhaust hole 2h formed in the body 2, a filter 2g provided in the suction hole 2f, and a filter 2i provided in the exhaust hole 2h. Furthermore, while housing the semiconductor wafer 4 in the internal space 2k of the body 2, outdoor air is taken from the suction hole 2f into the internal space 2k via a filter 2g, and the air in the internal space 2k is discharged from the exhaust hole 2h to the outside of the body 2 thus ventilating the air.SELECTED DRAWING: Figure 1 |
