发明名称 METHOD OF MANUFACTURING EPITAXIAL WAFER AND SILICON-BASED SUBSTRATE FOR EPITAXIAL GROWTH
摘要 A method of manufacturing an epitaxial wafer having an epitaxial layer on a silicon-based substrate, the method of manufacturing the epitaxial wafer including epitaxially growing a semiconductor layer on the silicon-based substrate after applying terrace processing to an outer peripheral portion of the silicon-based substrate. As a result, the method of manufacturing the epitaxial wafer having the epitaxial layer on the silicon-based substrate in which an epitaxial wafer which is completely free from cracks can be obtained, is provided.
申请公布号 US2016365239(A1) 申请公布日期 2016.12.15
申请号 US201515120924 申请日期 2015.02.10
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 HAGIMOTO Kazunori;SHINOMIYA Masaru;TSUCHIYA Keitaro;GOTO Hirokazu;SATO Ken;SHIKAUCHI Hiroshi;KOBAYASHI Shoichi;KURIMOTO Hirotaka
分类号 H01L21/02;H01L29/20 主分类号 H01L21/02
代理机构 代理人
主权项
地址 Tokyo JP