| 摘要 |
PROBLEM TO BE SOLVED: To realize a wiring structure having highly reliable wiring with a high yield by improving adhesion between a diffusion prevention layer of wiring and an insulating resin layer covering the same.SOLUTION: The wiring structure includes: Cu wiring 4; a barrier layer 5 for covering the Cu wiring 4 to prevent diffusion of a material of the Cu wiring 4; and an insulating resin layer 7 for covering the barrier layer 5. At an interface between the barrier layer 5 and the insulating resin layer 7, an adhesion layer 6 for adhering the barrier layer 5 and the insulating resin layer 7, is formed.SELECTED DRAWING: Figure 4 |
