| 摘要 |
PROBLEM TO BE SOLVED: To provide a member for a semiconductor device in which there is no generation of a crack and a release at a long period of time of use, and which is excellent in gas barrier property and adhesion.SOLUTION: A thermosetting resin composition contains (A) a polysiloxane having an epoxy equivalent of 800 to 2,000 g/eq. and represented by formula (1): (RRRSiO)(RRSiO)(RSiO)(SiO)(OR), (B) an epoxy compound, (C) a curing agent, and (D) a curing catalyst, wherein the total of the epoxy equivalent of (A) the polysiloxane and (B) the epoxy compound contained in the thermosetting resin composition is 600 to 1,500 g/eq.; and the storage elastic modulus at 150°C of a cured material formed by a thermal treatment of the thermosetting resin composition as measured by a dynamic viscoelasticity measurement is 5.00×10to 1.50×10Pa. |
