REMOVABLE SUBSTRATE FOR CONTROLLING WARPAGE OF AN INTEGRATED CIRCUIT PACKAGE

摘要

One embodiment of the present invention sets forth a technique for packaging an integrated circuit die. The technique includes bonding a first surface of the integrated circuit die to a first substrate via a first plurality of solder bump structures and bonding a second substrate to a second surface of the integrated circuit die. The technique further includes bonding the first substrate to a third substrate via a second plurality of solder bump structures and, after bonding the first substrate to the third substrate, removing the second substrate from the second surface of the integrated circuit die. The technique further includes disposing a heat sink on the second surface of the integrated circuit die.

主权项

1. A method for packaging an integrated circuit die, the method comprising:
bonding a first surface of the integrated circuit die to a first substrate via a first plurality of solder bump structures; bonding the first substrate to a second substrate via a second plurality of solder bump structures; after bonding the first substrate to the second substrate, disposing a heat sink on a second surface of the integrated circuit die.