发明名称 |
ELECTRONIC COMPONENT SOCKET |
摘要 |
An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate. |
申请公布号 |
US2016308293(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201415108282 |
申请日期 |
2014.12.24 |
申请人 |
ENPLAS CORPORATION |
发明人 |
NARUMI Keiichi |
分类号 |
H01R12/71;H05K7/20;H01R12/70 |
主分类号 |
H01R12/71 |
代理机构 |
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代理人 |
|
主权项 |
1. An electronic component socket, comprising:
a socket main body having an accommodating part for detachably accommodating an electronic component; a socket cover having a one-side end portion pivotally supported by the socket main body to open or close the accommodating part, and an other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body, the socket cover being held in a closed state by locking the other-side end portion to the socket main body; and a heat dissipating member mounted on the socket cover to press the electronic component accommodated on the accommodating part in the closed state, wherein the socket cover internally includes a metal plate extending from the one-side end portion to the other-side end portion so that a thickness direction of the metal plate is parallel to a direction in which the socket cover faces the accommodating part in the closed state, and the metal plate has a depression formed by bending along a line parallel to a rotation shaft of the socket cover in a vicinity of an area that receives a reaction force created by a pressing force that the heat dissipating member applies to the electronic component. |
地址 |
Kawaguchi-shi JP |