OLED PACKAGING METHOD AND OLED PACKAGING STRUCTURE

摘要

The present invention provides an OLED packaging method and an OLED packaging structure. The OLED packaging method includes the following steps: providing a TFT substrate (1) and a package lid (2); forming air channels (21) on the package lid (2); forming an OLED device (11) on the TFT substrate (1); coating a loop of desiccant (12) on the TFT substrate (1) along an outer circumference of the OLED device (11) and coating a loop of a dam (13) along an outer circumference of the desiccant (12); laminating the TFT substrate (1) and the package lid (2) together; and pressing the TFT substrate (1) and the package lid (2) together and applying irradiation of ultraviolet light to cure the dam (13). The method effectively eliminates the issue of resin flushing caused by a difference of air pressures inside and outside the packaging structure in bonding the package lid and the TFT substrate so as to improve the property of water resistance, enhance mechanical strength of the packaging structure, and improve packaging effectiveness.

主权项

1. An organic light emitting diode (OLED) packaging method, comprising the following steps:
(1) providing a thin-film transistor (TFT) substrate and a package lid; (2) forming air channels in two opposite side portions of a surface of the package lid that faces the TFT substrate to extend between and through front and rear end faces of the package lid; (3) forming an OLED device on the TFT substrate; (4) coating a loop of desiccant on the TFT substrate along an outer circumference of the OLED device and coating a loop of a dam along an outer circumference of the desiccant; (5) laminating the TFT substrate and the package lid to each other, wherein the air channels make inside and outside air pressure consistent; and (6) pressing the TFT substrate and the package lid together and applying irradiation of ultraviolet light to cure the dam and thus, completing the packaging of the OLED device.