发明名称 |
METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT |
摘要 |
An electronic component, such as an integrated circuit, includes one or more circuits with bumps extending in a longitudinal direction outward from the circuit. The bumps may be formed, e.g., by 3D printing, with at least one protrusion extending away from the longitudinal direction. |
申请公布号 |
US2016315059(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201514980616 |
申请日期 |
2015.12.28 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
CREMA Paolo;MAGNI Pierangelo |
分类号 |
H01L23/00;B29C67/00;G05B19/418 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Agrate Brianza IT |