发明名称 Liquid processing apparatus
摘要 A liquid processing apparatus according to the present disclosure includes a substrate holding unit configured to be rotated and hold a substrate from a bottom side thereof with substrate being spaced apart horizontally, a rotation driving unit configured to rotate the substrate holding unit, and an air supply unit provided above the substrate and configured to supply air toward the substrate held by the substrate holding unit. The liquid processing apparatus also includes an air supply path including a suction port that inhales the air supplied from the air supply unit and supplies the air inhaled from the suction port to a space formed between the substrate holding unit and a bottom surface of the substrate held by the substrate holding unit.
申请公布号 US9452452(B2) 申请公布日期 2016.09.27
申请号 US201313783552 申请日期 2013.03.04
申请人 Tokyo Electron Limited 发明人 Egashira Koji
分类号 B08B3/02;H01L21/67 主分类号 B08B3/02
代理机构 Abelman, Frayne & Schwab 代理人 Abelman, Frayne & Schwab
主权项 1. A liquid processing apparatus comprising: a liquid processing chamber configured to accommodate a substrate; a substrate holding unit configured to be rotated and hold the substrate from a bottom side thereof with the substrate being spaced apart horizontally; a rotation driving unit configured to rotate the substrate holding unit; a nozzle configured to supply processing liquid to the substrate held by the substrate holding unit; an air hood having an air supply unit provided above the substrate held by the substrate holding unit and configured to supply air into the liquid processing chamber; an air supply path having a chamber side supply pipe which includes a suction port that inhales air supplied from the air supply unit and configured to supply the air inhaled from the suction port to a space formed between the substrate holding unit and a bottom surface of the substrate held by the substrate holding unit; and a recovery cup provided to surround the substrate holding unit and configured to recover the processing liquid scattered laterally from the substrate to a circumference of the substrate holding unit, wherein the suction port of the air supply path is disposed in an outside and above of the recovery cup within the air hood, and at least a portion of the chamber side supply pipe existing within the air hood is disposed outside the recovery cup when viewed in a plan view.
地址 Tokyo JP