| 发明名称 |
CHIP COMPONENT AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A chip component includes a first body part in which at least one pillar part is formed, a winding coil having a central portion fitted onto the at least one pillar part, and a second body part stacked on the first body part so that the winding coil is embedded between the first body part and the second body part. |
| 申请公布号 |
US2016307688(A1) |
申请公布日期 |
2016.10.20 |
| 申请号 |
US201615077608 |
申请日期 |
2016.03.22 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Jong Ik |
| 分类号 |
H01F27/28;H01F27/02;H01F41/02 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip component comprising:
a first body part in which at least one pillar part is formed; a winding coil having a central portion fitted onto the at least one pillar part; and a second body part stacked on the first body part so that the winding coil is embedded between the first body part and the second body part. |
| 地址 |
Suwon-si KR |
