发明名称 |
Leaded semiconductor device package for use in nonsoldering assembling |
摘要 |
A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contacting and directly assembling without soldering. |
申请公布号 |
US6395982(B2) |
申请公布日期 |
2002.05.28 |
申请号 |
US19980209345 |
申请日期 |
1998.12.11 |
申请人 |
NELSON WILLIAM JOHN;TSENG ALICE;LEE K. R.;LAI STANLEY |
发明人 |
NELSON WILLIAM JOHN;TSENG ALICE;LEE K. R.;LAI STANLEY |
分类号 |
H01L23/48;H01L21/48;H01L23/495;H05K3/30;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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