发明名称 SLURRY FEEDING DEVICE, SLURRY FEEDING METHOD, AND POLISHING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To adjust the grain size of abrasive grains contained in slurry, to thereby prevent formation of oversized grains. <P>SOLUTION: The slurry feeding device is formed of a concentrate slurry stock tank 1 or 2, a slurry preparing tank 3, a pipe 9 connecting between the concentrate slurry tank 1 or 2 and the slurry preparing tank 3, a feed pipe 11 for feeding the slurry from the slurry preparing tank 3 to a polishing device, and a grain size sensor 5. Herein the grain size sensor 5 functions to monitor the abrasive grain size or abrasive grain density of the slurry, and the grain size sensor 5 is provided for the concentrate slurry stock tank 1 or 2, or for the slurry preparing tank 3. As a result, feeding of the slurry containing defective grains is avoided before polishing, and stable polishing of a workpiece is achieved, to thereby prevent formation of microscratches on the workpiece. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004358587(A) 申请公布日期 2004.12.24
申请号 JP20030157928 申请日期 2003.06.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ITOU FUMITAKA
分类号 B24B57/02;B24B37/00;H01L21/304;(IPC1-7):B24B57/02 主分类号 B24B57/02
代理机构 代理人
主权项
地址